Senior Principal AI Interconnect Architect

Stack

Responsibilities

• ▹Develop architectures for chip-to-chip interconnects and switched fabrics tailored for AI/ML scale-out
• ▹Analyze trade-offs in bandwidth, latency, power, area and reliability
• ▹Participate in industry standard bodies and contribute to shaping the direction of industry specifications
• ▹Work cross-functionally with SoC, package design and software teams to ensure seamless integration

Requirements

• ▹Master's or Ph.D. in Electrical Engineering, Computer Engineering, or Computer Science
• ▹10-15 years experience developing interconnect technologies including transport and link level protocols, switching fabrics, QoS, reliable communication methods and Software Defined Networking
• ▹Familiarity with various fabric topologies (Fat tree, Leaf-Spine/Clos, Torus, Meshed) and their applicability
• ▹Familiarity with GPU/accelerator clusters and data center infrastructure
• ▹Deep knowledge of interconnect technologies and protocols: PCIe, CXL, NVLink, UALink, Ethernet, Ultra-Ethernet, serial links
• ▹Ability to develop performance models (modeling and simulation)

About the company

Sandisk is a global leader in Flash memory and storage solutions, with a rich history of innovation in Flash and advanced memory technologies. The company operates two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced Fourth Industrial Revolution innovations, and as Sustainability Lighthouses for efficient operations.