3D Memory Chip Architect and Design, Principal Engineer

Stack

Responsibilities

• ▹Develop and optimize 3D DRAM/FLASH organization and near-memory computing architectures for high density, high TOPS/mm2 and high TOPS/W
• ▹Develop and validate models for 3D memory performance, power and yield as a function of bank, TSV and power distribution choices
• ▹Develop novel fabrics for robust distribution of high-bandwidth data from 3D DRAM memory arrays to near-memory computing units across mobile, compute and XR workloads
• ▹Develop power distribution topology enabling robust memory operation in the 3D stack
• ▹Simulate and emulate system performance of 3D memory architecture choices across AI, compute and mobile workloads
• ▹Floorplan 3D memory chips and design memory array control structures under 3D integration manufacturing constraints, testability, repairability and performance requirements
• ▹Apply knowledge of chip connection fabrics such as UCIe, UAL, LPDDR, HBM3/4 and PCIe

Requirements

• ▹Bachelor's degree in Science or Engineering and 8+ years of ASIC design, verification, validation or integration experience (or Master's + 7 years, or PhD + 6 years)

Nice to have

• ▹Experience in RTL, circuit and system design to model and optimize dataflow
• ▹Experience in SoC architecture and power/clock/bus design
• ▹Experience in DRAM/FLASH architecture performance assessment
• ▹Experience in memory circuit design (SRAM/DRAM/FLASH/ROM etc.)
• ▹Experience in a programming language (C/C++/Python) or scripting language (Perl/Python)
• ▹Ability to develop Verilog/Verilog-A/Verilog-AMS models of critical dataflow
• ▹Familiarity with DRAM/FLASH datasheets and IO interfaces
• ▹Experience in ASIC design, mixed-signal design and performance modeling
• ▹Good knowledge of memory architecture, buses and 2.5D/3D integration
• ▹Proficiency in EDA tools, MATLAB and Python
• ▹Master's or PhD in Electrical Engineering, Computer Science or related field

Soft skills

What we offer

• ▹Pay range: $192,000-$288,000
• ▹Annual discretionary bonus program
• ▹Opportunity for annual RSU grants
• ▹Competitive benefits package

About the company

Qualcomm's Custom Memory Team, part of the Process & Package Solutions Group, works on 3D memory architecture and design for memory-centric compute systems across data center, mobile, compute and XR applications.