Lead Expert – Hybrid Bonding, CMP & Advanced Packaging Metrology

Responsibilities

• ▹Lead identification of unmet metrology needs and critical process-control gaps in CMP, hybrid bonding, and advanced packaging
• ▹Define the most valuable measurements, specifications, and use cases (topography, dishing, erosion, surface roughness, edge roll-off, wafer shape, bonding interfaces, die uniformity)
• ▹Set application priorities and translate customer and manufacturing needs into product and technology roadmaps
• ▹Lead engagement with customers, process engineers, and equipment partners to validate requirements and accelerate adoption
• ▹Drive development of metrology solutions that improve yield, process stability, qualification time, and manufacturing performance
• ▹Guide R&D and product teams on measurement performance, workflow integration, sampling strategies, and high-volume manufacturing requirements

Requirements

• ▹Significant experience in semiconductor process integration, CMP, hybrid bonding, or advanced packaging
• ▹Strong understanding of metrology, inspection, and process control in high-volume manufacturing
• ▹Experience working with leading semiconductor fabs, equipment suppliers, or advanced R&D organizations
• ▹Proven ability to lead cross-functional teams and convert complex process challenges into differentiated products

About the company

Nearfield Instruments (NFI) is a fast-growing, high-tech scale-up that designs, develops, integrates, markets, and services advanced metrology machines, enabling leading chipmakers with a unique high-throughput Scanning Probe Microscopy (SPM) platform.